If your parts come off the plates with uneven thickness, a hazy finish or a slow cycle time, the cause is often not the abrasive alone. In a Double Side Grinding Machine, the speed of each platen, sun gear and ring gear decides how every workpiece moves, and that motion decides flatness, roughness and output. This guide explains the principles and shows what to check before you buy.
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A double-sided grinding machine, also called a double-sided lapping or polishing machine, machines both faces of a part in a single pass. The parts sit inside thin carriers (planetary gears) between a lower platen and an upper platen. Both platens carry abrasive or a polishing pad, so the top and bottom surfaces are worked at the same time and under the same load.
Platen rotation creates the relative motion between abrasive and workpiece. A widely cited model, Preston's equation, says the removal rate is roughly proportional to pressure multiplied by relative velocity. Speed therefore acts as a direct control on material removal and on how evenly the cut is spread across the surface.
Different materials call for different speed combinations. Brittle optical glass, sapphire, silicon wafers, ceramics and metals each respond differently to heat, pressure and abrasive load. That is why speed control matters for both quality and production efficiency.
The lower platen usually supports and drives the carriers, while the upper platen presses down and applies working pressure. When the two platens turn in opposite directions, the relative sliding speed at the workpiece is higher. When they turn in the same direction, the relative speed drops and the cut becomes gentler. The difference between the two speeds also changes how the abrasive path crosses the part, which affects how evenly the face is covered.
Workpiece motion is further controlled by the planetary system. The sun gear in the centre and the ring gear on the outside drive the planetary carriers. Their speeds set how fast each carrier orbits and how fast it spins on its own axis. Combined with the platen speeds, this produces the looping, non-repeating path that spreads wear evenly across both platens and the part.
Because material, part size and target finish all change what an ideal motion pattern looks like, the speed combination has to be adjustable rather than fixed.
To improve double-sided quality, adjust one variable at a time, record thickness variation, total thickness variation (TTV) and roughness, and compare. Small, controlled changes in the speed ratio are more reliable than large jumps.
Does higher platen speed always mean higher efficiency? No. Raising speed does increase relative velocity and usually the material removal rate. But beyond a certain point you gain heat, vibration, slurry that is thrown off the platen, and unstable contact. Scrap, re-work and platen conditioning then cancel the time you saved.
Different stages need different speeds. Rough grinding typically tolerates higher relative speed to remove stock quickly. Finishing stages usually run slower, with lighter pressure, to protect flatness and roughness. A practical strategy is staged processing: speed up while stock is being removed, then reduce speed as you approach final thickness.
When the upper platen, lower platen, sun gear and ring gear can each be set separately, engineers can tune motion for each product instead of accepting a compromise. Soft metals, hard ceramics, thin wafers and thick optical blanks all need different strategies. Independent adjustment also helps when thickness or accuracy requirements change from one order to the next.
Our 28B/30B/32B/35B high-precision double-sided grinding/polishing machine provides four independently adjustable drives:
| Component | Speed Range |
|---|---|
| Upper Platen | 1–20 RPM |
| Lower Platen | 1–60 RPM |
| Sun Gear | 1–30 RPM |
| Ring Gear | 1–30 RPM |
Stable speed regulation depends on the control system. This series uses a Mitsubishi Electric PLC, frequency inverter and HMI, with TECO motors and an in-house high-precision worm gear reducer. The PLC and inverter keep each drive at its set point, while the operator changes parameters from the touch screen. The same machine also uses closed-loop pressure control: a precision pressure sensor, PLC and electrically controlled proportional valve, with working pressure from 90 kg (900 N) up to a standard maximum of 1500 kg (15000 N).
There is no universal speed that fits every job, and we do not recommend copying an unverified recipe from another factory. Use these factors as a starting point and confirm by trial:
On the 28B/30B/32B models, for example, the maximum machining diameter is 660, 700 and 760 mm, and the maximum processing thickness is 35 mm, with five planetary gears and four motors. For smaller parts or laboratory-scale production, compare the 6B/6.4B, 9B/9.6B, 12B/13B/13.9B and 16B/18B models. If heat control is a priority, review the 16B/22B water-cooled machine and the 20B/22B/24B series. For one-face finishing, see our single-sided polishing machines. Browse everything in the double-sided lapping/polishing machine catalogue.
Whether you want a Double Side Grinding Machine for optics, wafers or metal parts, the right speed control makes the difference between a machine that merely runs and one that repeats. Learn more about Morinaga or contact our team.
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